ATA ENGINEERING, INC. — National Aeronautics and Space Administration SBIR Phase I: Z7

Description

The development of next-generation thermal protection systems (TPSs) is a critical focus for NASA, which is spearheading the advancement of automated fabrication techniques for 3D woven TPSs, which can potentially be tailored to provide weave architectures with mission-specific properties for applications such as deployable heat shields (ADEPT) and interplanetary probes (HEEET). Full application of the technology is hindered by a lack of understanding of automated loom manufacturing processes and the resulting woven productsrsquo; thermomechanical properties. ATA Engineering proposes a Phase I project to improve the control and quality of 3D weaving processes through development of an analysis-driven weaving diagnostics technology. The technology will be incorporated into ATArsquo;s COMPAS material modeling framework to support uniform scaling up of 3D woven preforms and accurate prediction of resulting macroscale properties.ATA will implement a physics-based analytical modeling approach to capture the process-to-properties link. The analysis workflow will involve four key components: (1) a kinematic virtual fiber model capable of modeling flexible yarn behavior, large yarn displacements, and contact during the weaving process, (2) a solid mechanics model to map the deformed weave state and fiber loads/damage to a unit cell representation of the weave, (3) a second solid mechanics FEM to represent the void space between the yarns in the unit cell, which will be virtually infiltrated to estimate material system continuum properties, and (4) a solid mechanics coupon-scale model of the final 3D composite that can be used for virtual testing to recover the as-manufactured material properties.In Phase II, ATA will work with 3D-weaving stakeholders to apply the technology to a relevant loom. The analytical tool will link the loom processes and diagnostics to the weave properties and mechanical response, creating a path for more robust WTPS characterization and qualification.