LYNNTECH INC. — Department of Defense SBIR Phase I: N201-086

Description

Avionics packaging of circuit card assemblies (CCAs) provide protection to the electronic components from environmental factors such as moisture, corrosion-inducing contaminants and radiation. They also protect the parts from mechanically induced damage such as bending, vibration and material fatigue caused by thermal shock and temperature cycling during actual life applications. Current solutions for avionics packaging technology primarily depend on the use of aluminum metal based structures for ensuring mechanical, thermal and environmental protection. Lynntech proposes a novel thermally conductive polymer composite based avionics packaging solution for this application that will reduce the mass, while maintaining or improving the properties to meet mechanical, thermal and environmental requirements. The proposed material solution is targeted to provide thermal conductivity > 150 W/mK and provide electromagnetic interference (EMI) shielding effectiveness for the CCAs. The Phase I of the project will demonstrate proof of concept polymer composite material and designs with the required thermal and EMI shielding properties. Material selection during Phase I will be made to satisfy the environmental, mechanical and thermal requirements of the smart munition application.