OZARK INTEGRATED CIRCUITS INC — Department of Energy SBIR Phase II: 11a

Description

Access to the earth’s subsurface requires technologies that can operate at extremely high temperatures and pressures. Enhanced geothermal systems (EGS) require directional drilling deep (10,000 meters) into hot wells with temperature profiles exceeding 325 ºC; while making better use of each well through techniques such as fracking and zonal isolation. Establishing a well requires electronics that can withstand temperature/depth profiles will transmitting critical telemetry to inform directional drilling. Present-day electronic systems only last 4-6 hours in this environment, and even fiber optic systems (that only monitor temperature) cannot survive for the 30 days above the 200°C routinely experienced in the establishment of a well. Ozark IC is a leader in the development of high-temperature electronic modules (SmartNodes) with nominal operating temperatures (TNOM) of 100 ºC (plastic circuit board) 200 ºC (silicon-on-ceramic), 250 ºC (SOI-on-ceramic), and 500 ºC (SiC on ceramic). During Phase I, Ozark IC successfully transitioned its data acquisition (AQ) SmartNode, AQ-100 to its high-temperature, high-density variant, the AQ-200, yielding a technology leap of 100 ºC and an 87% reduction in size, both of which are critical enablers of downhole computing. Also during Phase I, mechanical designs were explored resulting in power/data transmission scheme for the down-hole electronics. A variety of cables and connectors were measured in detail to create high-fidelity simulation models of a downhole computing network. The results were used to create the specification of a modular down-hole communication and sensing/actuation system, based on the AQ-200 module. Simulation models suggest a data transmission rate of 10K bits pers second over a distance of 10K meters is feasible. In Phase II, Ozark IC will produce four prototypes of the AQ-200 and with is wireline power/data plugin module, (AQ-200-WL) and assemble a 3-segment drillpipe mock-up to validate the connectors, cables, and electronics packaging schemes designed and prototyped during Phase I. This validation is the critical first step before manufacturing a volume of units that can support testing in geothermal, oil and gas fields. Packaged modules will be connected by the wireline and tested simultaneously while at different temperatures (190 to 250oC+) to validate the operation through a depth-temperature profile common to geothermal wells explored to date. In addition to its application in enhanced geothermal wells, the anticipated public benefits of the proposed research begin with enabling next generation oil and gas exploration and well monitoring. The technology can also be applied widely to aerospace applications, to enable higher performance turbine engines and may ultimately be applied to automotive applications to improve the control and efficiency of internal combustion engines.