SILICON TECHNOLOGIES, INC. — Department of Defense SBIR Phase II: A18-009

SILICON TECHNOLOGIES, INC. — SBIR Phase II award from Department of Defense.

Amount
$599,969
Agency
Department of Defense · Army
Program / Phase
SBIR · Phase II
Topic
A18-009
Solicitation
18.1
NAICS
Place of performance
UT
Period
2019-10-31 → 2021-07-09

Description

The Army requires a SWAP-C update of the M734A1 multi-option fuze circuit used in 60mm, 81mm, and 120mm mortar shells. Silicon Technologies Inc. (STI) has successfully developed a SWAP-C replacement that reduces the power used in the current system by 3X, reduces part count by 2X and part cost by 10X, reduces the weight by a minimum of 2X and the size of the current system used for fuse applications. Silicon cost for the chip will be less than $0.25 in volume production and will use less than 40 milliwatts (mW) while using a single 1.8-volt (V) power supply. STI has created novel design architecture to be the first product in a new family of low power Data Converters on a Chip ASICs. The ASIC shall be built using STI’s proprietary ADONIS technology which will provide the Army, its Primes, and other customers the ability to port the ADC to other processes at reduced cost and risk. The STI Data Converters on a Chip ASIC will allow customers to incorporate the design as intellectual property (IP) for their system-on-chip (SOC), or to engage STI to develop the IP further as a chip specific to their needs.