EO VISTA, LLC — Department of Defense SBIR Phase II: X224-ODCSO2

Description

Traditional Space sensors provide single modality information which typically then need to be coregistered and integrated on the ground.  As the time of relevance shrinks significantly and processing moves to the forward edge onboard platforms to minimize the need to downlink large amounts of information back to a ground processing node, sensors that can collect and co-register multiple modalities in real-time and generate actionable intelligence are required. EO Vista has created the above in a Tri-Int EO/IR Sensor System-on-a-Chip. The Tri-Int Sensor closes a critical capability gap by creating a compact single sensor system-on-a-chip having co-registered (1) Long-range, High-Resolution Multispectral Imagery (MSI),  (2) a “spectrometer-on-a-chip” capability providing HSI imagery with real-time tipping/cueing, and (3) real-time 24-hr 3D stereo geolocation of each pixel in the scene.  In addition, the System-on-a-Chip eliminates the need for large spectrometers in Hyperspectral sensors, significantly reducing the SWAP of spaceborne HSI sensors, particularly in the LWIR. This SBIR investigates and begins implementation of a commercial Digital Readout Integrated Circuit (ROIC) as part of the Tri-Int solution.  We procure the ROIC and interface it to our existing processing hardware and algorithms demonstrating the suitability of the commercial components as a key contributor to generating the Tri-Int solution.