Wintec, Inc. — Department of Defense SBIR Phase I: Current methods for physically interconnecting the electrical interfaces on micro-munition

Description

Current methods for physically interconnecting the electrical interfaces on micro-munitions or other small stores to host platforms or other carriage devices rely on traditional military style circular connectors. These connectors have significant physical footprints in locations where space is at a premium, typically exhibit higher than desired release forces that undesirably constrain potential store ejection techniques, have reliability/durability issues, and are cumbersome to connect for some store physical installation scenarios. Other physical interconnection techniques including both wireless technologies and alternative conductor-based interconnection techniques (such as tear-away connectors or butted contacts on mating surfaces) have the potential to provide the necessary physical signal interconnectivity while eliminating some or all of the stated drawbacks. The effort proposed here will investigate/evaluate alternative technologies for physical interconnection of required signal paths across micro-munition electrical interfaces, and define one or more candidate alternative interconnection schemes based on those alternative technologies deemed to be most viable within the applicable implementation constraints. A plan for a recommended follow-on program to accomplish prototyping and demonstration of the defined alternative interconnection scheme(s) will also be documented. BENEFIT: The technology developed under this effort will facilitate easier and more reliable electrical mating of micro-munitions with host platforms. It also has significant potential for commercial application in integration of external sensors on non-military air and ground platforms.