Aurora Semiconductor, LLC — Department of Defense SBIR Phase I: AF171-121

Description

Obsolescence of electronic parts, and diminishing manufacturing sources and material shortages (DMSMS) for integrated circuits (ICs) has driven the need for innovation in systems support. Die extraction and reassembly (DER) technology has been demonstrated to be a feasible option for replacing monolithic military integrated circuits. This project will demonstrate the feasibility of building complex multichip modules (MCMs) with Aurora Semiconductors 4DHSiP process from integrated circuit die harvested using Auroras BondCoin DER technology. The documented test plan will assess the electrical performance, characteristics, and reliability of the IC/Module devices, and will lead to a certification process for MCMs produced via the 4DHSiP process. This advancement of the technology gives electrical and packaging engineers developing systems and hardware access to the latest technology, and provides viable options for component replacement at significantly lower costs than previous, limited options. These same benefits, i.e. viable options for IC/Module component replacement at comparatively low costs, can also be realized in a host of demanding commercial applications that require reliable performance in extreme, high stress environments, and whereby a required die may be available, but not in the needed form/package.