Boston Micromachines Corporation — National Aeronautics and Space Administration SBIR Phase I: S2.01

Description

We propose to develop a design and manufacturing approach for a small-stroke, high-precision deformable mirror scalable to 10,000 actuators, that promises inherent advantages in scalability, yield, and reliability in comparison to current generation microelectromechanical systems (MEMS) DMs, to address a technology gap for next-generation planet finding instruments. Our proposed design aims to ensure high yield while maintaining a superb optical quality and retain the proven aspects of BMC?s commercial MEMS DM design and core manufacturing processes. Our objective in the Phase I project is to complete a design study for an innovative approach to scaling up our MEMS DM technology. We will develop new approaches to design and fabrication of routing lines by replacing the single wiring layer by interconnected, stacked wiring layers, and replacing wirebond technology with a flip-chip architecture for the device-to-package integration to overcome two key challenges that currently limit MEMS DM scalability to higher actuator counts. The outcome of the Phase I work will be the design and mask layout of the 10,000 actuator DM, the design and layout of the 10,000 channel PCB subassembly, and the development of a flip-chip bonding process that will enable the fabrication of this DM in a Phase II effort.