ENGENIUSMICRO LLC — Department of Defense SBIR Phase I: MDA17-011
ENGENIUSMICRO LLC — SBIR Phase I award from Department of Defense.
- Amount
- $154,996
- Agency
- Department of Defense · Missile Defense Agency
- Program / Phase
- SBIR · Phase I
- Topic
- MDA17-011
- Solicitation
- 2017.2
- NAICS
- —
- Place of performance
- AL
- Period
- 2017-11-06 → 2019-01-05
Description
This proposal seeks to develop a 3D printing process to print a 3D package around a bare semiconductor die where the package is tailored to fit the application. When semiconductors are fabricated, they are typically sent to a foreign country for packaging. Within the foreign country, it is possible the part is counterfeited. 3D printing of a component package around a bare die should allow for the manufacturer to keep the packaging at the same location as the die manufacturing and reduce the risk of counterfeiting. During the Phase I effort we will develop and conduct proof-of-principle demonstrations of the process and provide evidence of adherence to MIL-PRF-38535.Approved for Public Release | 17-MDA-9395(24 Oct 17)