GLOBAL CIRCUIT INNOVATIONS INC — Department of Defense SBIR Phase I: AF161-142

Description

ABSTRACT: Global Circuit Innovations (GCIs) die extraction and reassembly technology(DER) generated initial interest in and demand by the commercial industry through demonstrating the value of remanufacturing an original integrated circuit (IC) from a plastic component into an environmentally hardened ceramic component, typically for the high-temperature oil and gas drilling service sector.Another unique benefit of this capability is to address military obsolescence IC component issues by locating equivalent donor ICs in undesired packages/substrates (when possible), extracting the die from the package, and assembling it into the target package or footprint.Thus, although the target device is truly obsolete, there may be sufficient stock of the desired IC in other packages to solve the end customer requirement.GCI proposes an in-depth effort to focus this solution on additional complex analog and digital high performance military ICs (e.g., radar devices) for the specific purpose of evaluation of assembly yields, IC performance stability, and long-term reliability.Additional component testing and/or increased quality and reliability testing at the very least could qualify additional part types for military use, as well as provide data for continued qualification efforts of the entire process.; BENEFIT: The evaluation of additional components through the DER process will necessarily qualify these specific components and provide a solution for any program requiring these devices. Therefore, the initial component selection should be strategic. Additionally, this study would provide a more thorough examination of the process and final product, particularly as screened to the demanding test specifications of Mil-Std 883.Depending on the ability of this study to attract more funding, any number of products could be sufficiently validated, with the final goal of qualifying the DER process across the board for any/all extractable IC devices. Ultimately, a significant percentage of current and future electronic obsolescent solutions could be resolved at the component level, rather than at a system level.The net effect of moving in this direction would be the ability to save tens of millions of dollars and decrease the solution lead time from years to months.