Bioenno Tech, LLC — Department of Defense SBIR Phase I: N162-117

Description

In this project, we propose to develop a low-cost scalable spin-spray process for high-volume manufacturing of RF thin/thick film materials on large-scale flexible PCB substrate. In Phase I, we will demonstrate spin spray deposited low-loss ferrite/insulator multilayers on large panel PCBs that can be scaled up to 48 48, and fabricate the integrated RF circuits and RF antenna circuits on PCB with superior RF performance. In addition, we will demonstrate the ability to develop and manufacture an RF material with an index of refraction greater than 10 at 2 GHz. In the end of Phase I, we will deliver a prototype sample of 12x 12, 100 grams of filler material, and a plan to scale up the materials manufacturing. In the subsequent Phase II, we will further refine the manufacturing technique and demonstrate consistent electrical properties, temperature range and environmental stability, and fully the scalability to 48 48 (4 ft x 4 ft) of material. We will also finalize the development including optimizations and scaling up, and work with an industry partner or a DoD prime contractor to develop processes so that the developed materials/processing can be readily implemented on existing and future Navy assets with a potential large scale