KYMA TECHNOLOGIES, INC. — Department of Defense SBIR Phase I: A16-021

Description

Kyma Technologies, the leading domestic supplier of single crystal nitride semiconductor substrate materials, and Michigan State University (MSU), a leading developer of electronic grade diamond materials, are teamed together to develop the first domestic supply of large area electronic grade single crystal diamond wafers. The technical approach is based on a novel tiled or mosaic substrate fabrication technique in which small, regular-shaped single-crystal diamond substrates are laterally arranged and overgrown to create large area single crystal electronic grade diamond substrates. The potential of the tiled or mosaic wafer concept has already been proven yet further advances in wafer size and electronic properties remain as primary engineering advancement opportunities. The proposed effort will use novel proprietary processes to extend the size of the mosaic wafers to 6 cm2 or larger while optimizing their electronic properties in terms of hole gas density and mobility. Success in the proposed effort will enable the first source of large area electronic grade diamond wafers, will set the stage for further increases in wafer size, and will position the US as a center of excellence in support the development of an entire new generation of ultra-high performance power and high speed electronic devices.