OMEGA MICRO TECHNOLOGIES, INC. — Department of Defense SBIR Phase I: N161-031

Description

A critical element in higher power systems such as T/R modules, communication transmitters, and EW modules, is power combiners. To obtain the necessary output power, systems typically require multiple combined power amplifiers. Various options are available, however, the trade-offs between options must be fully understood. Couplers based on planar structures or 2.5 dimensional designs are readily available either as custom designed circuits within the substrate, or as components. Another option depending upon the frequency band of operation, are waveguide or spatial based combiners. Trade-offs that must be taken into account include size, weight, insertion loss, bandwidth, power handling capacity, and size. There is a tremendous need for the development of low loss, small form factor, low cost, higher power combiners that can be integrated into a systems substrate or procured as a component. Omega Micro Technologies will leverage their expertise in the field of RF and microwave substrate design and fabrication to produce an innovative, high power combiner technology integrated into a low-temperature co-fired ceramic substrate yielding an optimum balance of design parameters. Multiple coupler topologies will be developed such that a broad range of frequencies, bandwidths, and output power can be supported.