TECH-X CORPORATION — Department of Energy SBIR Phase II: 14a

Description

As semiconductors heat up, thermal expansion induces mechanical stresses and these stresses can either cause failure, or a change in the performance due to changes in electron transport. Understanding these e ects is challenging due to the coupled physics nature of the problem. General statement of how this problem is being addressed This problem is being addressed by solving for each of the separate physics e ects; thermal, mechanical, electron transport, simultaneously, but in a coupled manner. The electron transport solver was developed and applied to the photocathode problem. A new physics solver for modeling mechanical stresses will be added to the VSim code. By using our unique coupled physics algorithms, we simultaneously run to electrical, thermal, and electron transport solvers. Enabling these coupled physics simulations will provide benefits for investigators at national laboratories wanting to understand photocathodes, and for the semiconductor industry wanting to better understand the e ects of thermal-mechanical stresses. Commercial Applications and other benefits Understanding thermal-mechanical stress in the semiconductor industry is becoming very important due to the wafers becoming thinner and small form factors becoming important. Photocathodes are a key component of light sou