Triad Semiconductor, Inc. — Department of Defense SBIR Phase II: MDA08-T007
Triad Semiconductor, Inc. — SBIR Phase II award from Department of Defense.
- Amount
- $1,772,175
- Agency
- Department of Defense · Air Force
- Program / Phase
- SBIR · Phase II
- Topic
- MDA08-T007
- Solicitation
- 2008.0
- NAICS
- —
- Place of performance
- NC
- Period
- 2015-06-24 → 2017-03-18
Description
ABSTRACT:A radiation hardened via-configurable mixed signal array (RHVCA-1) is proposed to provide a rapid prototyping mixed signal platform for implementing radiation hardened and high performance custom analog system designs. In phase I the feasibility of implementing RHVCAs was investigated. In the initial Phase II radiation hardened by design (RHBD) features were designed, fabricated and verified. Total ionizing dose (TID) teting was performed on a RHBD VCA and on a comparable Triad commercial VCA to determine the radiation hardness. Phase II results indicate the RHVCA concept is practically feasible and would provide and excellent means of developing prototype and production custom analog solutions for aerospace and defense applications. This Phase II effort will focus on the commercialization of RHBD VCA technology. The two key objectives in phase II will be: 1. Development and verification of a RHVCA-1 RHBD VCA platform test device on IBMs CMOS7RF (0.18 CMOS) process containing analog and digital building blocks necessary to implement the RHVCAs. 2. Development and fabrication of mixed signal ASICs for commercialization using the RHVCA-1 VCA platform. In the previous phase I and phase II STTR efforts, Triad worked with the University of Tennessee to research, design, prototype and test devices to further this research. No part of this effort will be done by the University of Tennessee. This proposal is submitted as an SBIR in accordance with SBIR Policy Directive, paragraph 4(b)(1)(i) exception. BENEFIT:The advantages of VCA technology over full custom design are many. They include the following primary advantages: 1. Rapid design and prototyping. 2. Fast and simple design changes 3. Significant reductions in size, weight, and power (SWAP). 4. Ease of intellectual property (IP) re-use. 5. Enhanced Reliability by integration of analog functions into one RHVCA on a commercially proven semiconductor process. 6. Mitigation of diminished manufacturing sources (DMS) issues. Once developed, a platform life cycle is expected to extend through the entire fabrication process life. Platforms will remain viable and in use indefinitely. 7. Lower total cost of ownership by using pre-developed and pre-tested VCAA platforms. Total cost savings per component are expected to be more than 50% leading to expansion of the product line offerings as well as funding the various qualifications required for space and national security applications.