TECHNOLOGY SERVICE CORP — Department of Defense SBIR Phase I: TSC is developing a intra-missile datalink that allows for high bandwidth (>2Gb/s) mult

Description

TSC is developing a intra-missile datalink that allows for high bandwidth (>2Gb/s) multi-mode, missile sensor data to be passed to the sensor data processor to minimize the use of cabling. This removes the issues caused by the cabling, such as integration time, cable volume and weight and gimbal sticktion. The developed concept will be ruggedized for missile applications and designed with low size, weight and power (SWAP). The datalink will offer full duplex operation with no need for alignment or line-of-site between the transceivers. TSC is partnered with Dynetics to leverage our complementary expertise and experience to produce a viable solution and transition it into a fielded system. TSC and Dynetics both have a long history of developing and fielding RF, microwave and millimeter wave electronics and datalinks for rockets and missiles that meet the stringent temperature, mechanical shock, vibration requirements of these platforms.