Radiance Technologies, Inc. — Department of Defense SBIR Phase II: Radiance Technologies proposes to perform advanced development, fabrication and demonstrat

Description

Radiance Technologies proposes to perform advanced development, fabrication and demonstration an innovative low-profile, multi-layered anti-tamper (AT) volume protection"detect and react"sensor suite prototype that meets MDA requirements for portability and reusability. It utilizes radiation and vibration sensors to detect radiological and vibrational reverse engineering attacks, combined with two penalty responses: a thin film nanoparticle gel layer to provide controlled energy release, and embedded software erasure. When attacked, this layered volume protection system will trigger one or both penalty responses. We will optimize the nanoparticle gel layer to provide a controlled release of thermal energy as a penalty response appropriate for specified sensitive components. The gel will be applied as a removable adhesive film to the critical technology before transit, and will be removed after transit. Radiance will develop an embedded software erasure penalty.response. We will apply the sensors and design and fabricate the penalty response system to a breadboard-level prototype volume protection device that is ready for technology demonstration and evaluation. The architecture will allow for additional layers of protection at a later date. This program will integrate all of components into a protected volume that meets MDA requirements for reusability and DOT transport requirements.