SA PHOTONICS, LLC — Department of Defense SBIR Phase I: ABSTRACT: Due to the high cost and long lead time of space based thermal management syste

Description

ABSTRACT: Due to the high cost and long lead time of space based thermal management systems, there is an increased need for a space qualified thermal network system which can maintain critical components within an acceptable range during operation and be flexible in design to adapt to a wide range of component sizes as well as varying thermal loading conditions. SA Photonics proposes their Intelligent Thermal Stabilizing System, which is modular, has the ability to monitor and control component temperatures and utilizes both standard and high thermal conductivity materials minimizing thermal resistance from source to sink. The core component in the ITSS for thermal networking the heat within an electronic subsystem is the combination of Thermoelectric Coolers (TECs) and our unique Thermal Interface Plate. Our ITSS configuration allows for the networking of thermal energy (thermal energy sharing) for power efficient system cooling/heating. The unique thermal transfer plate/TEC configuration also provides the ability for improved component thermal control through the TEC"s ability to act as both a high and low temperature heater and a chiller. This innovative thermal control design provides a unique and stable system that allows accurate and autonomous thermal control of space based electronics. BENEFIT: The main benefit of the SA Photonics ITSS system is the ability to monitor and control critical components within acceptable temperature ranges by the control of heat flow (thermal networking). The ITSS design will network components and heat sinks together maintaining temperatures through the directing of heat flow into and out of components and heat sinks. The ITSS utilizes TECs which also provide the benefit of increased thermal control due to the TECs ability to act as both a heater and a chiller. This network will minimize thermal resistance through the incorporation of cutting edge thermally conductive materials to optimize thermal flow performance.