Nuvotronics, LLC — Department of Defense SBIR Phase II: Microwave and mm-wave modules often leverage a combination of MMIC die, discrete devices,

Description

Microwave and mm-wave modules often leverage a combination of MMIC die, discrete devices, circuits on ceramics, and bond wires assembled into a metal housing that typically contains a series of connectors. While modern microelectronics has largely done away with hermetic packaging, many microwave modules still use hermetic lids to seal the enclosures, providing the dual function of protecting the circuits from environmental damage and blocking EMI to and from the circuit. This packaging approach incurs a significant cost penalty to the device, but the sensitivity of microwave circuit components to their local environment has prevented the use of more common, less expensive potting and plastic encapsulation solutions because it changes the behavior of the underlying circuit and can cause significant variation over time and temperature. During Phase I, Nuvotronics investigated several promising material solutions for MMIC packaging that provide protection from the environment and EMI shielding. During the Phase II project, Nuvotronics and its development team will refine novel material coating approaches developed in the Phase I project, and transition the optimum solution to MMIC suppliers for DOD applications.