TECHNOLOGY ASSESSMENT & TRANSFER, INC — Department of Defense SBIR Phase II: The current state of the art for integrating electromagnetic interference (EMI) shielding

Description

The current state of the art for integrating electromagnetic interference (EMI) shielding into sensor windows involves laminating conductor grids between two pieces of the window material. For complex shapes and high strength and erosion resistant window materials, such as spinel, polishing two surfaces for exact fit with optical precision becomes cost prohibitive. Technology Assessment & Transfer, Inc. (TA & T) has developed a process and material system for embedding grid conductor patterns in the spinel green state that are compatible with co-firing. The patterns are defined by soft lithography, which is an inexpensive and fast method of applying micropatterned structures to both flat and non planar surfaces. The conductors are then transferred, covered in the green ceramic compact, and maintain fidelity through all the processing required to achieve transparency in spinel. The resulting grid is expected to have low sheet resistance for high EMI filtering performance. The Phase II effort focuses on demonstration of manufacturability for a relevant radome application.