ADA TECHNOLOGIES, INC. — Department of Defense SBIR Phase II: AF09-BT22

Description

ABSTRACT: Thermal interface materials (TIMs) constitute an essential part of thermal management which is quickly becoming the limiting factor in high power, high functional density, and increasingly small-sized electronics for future U.S. Air Force (AF) platforms. TIMs aim to ensure a continuous thermal conductivity path between the heat source and heat sink/dissipater, thus permitting the efficient operation of electronics. The major impediment to achieving reliable TIMs is high thermal interfacial resistance, which increases over time due to introduction of air pockets and the loss of contact between the meshing surfaces under thermal cycling. ADAs TIM grease provides a 10C or better reduction in junction temperatures, at a fraction of conductive filler concentration compared to state-of-the-art, which enables this grease to sustain desired performance through severe thermal cycling conditions. The objective of this SBIR Phase II follow-on contract proposal is to enhance the technology and manufacturing readiness for ADAs nano-enhanced TIM grease and to integrate it with power system modules that are currently used on advanced fighter aircraft. BENEFIT: ADA has designed our efforts to realize the maturation (readiness level) of high-performance TIM grease materials through close collaboration with a Tier 1 supplier for platform insertion in military and commercial aircraft sub-components. If successful, ADAs technology will permit the development and usage of electronics that offer higher power and faster operating speeds by providing more efficient heat management. This will directly benefit capabilities in next generation AF efforts such as those anticipated in military aircraft, directed energy systems, satellites, and avionics. Furthermore, this technology will have direct benefits in many commercial electronics including personal electronics (e.g., laptops, cell phones, music players) and civilian aircraft, spacecraft, and other microelectronics applications.