CBRITE Inc — Department of Defense SBIR Phase I: ABSTRACT: This proposal is aiming for sensor integration into small form-factor applicati

Description

ABSTRACT: This proposal is aiming for sensor integration into small form-factor applications, such as helmet mounted systems (HMS) and small uninhibited air vehicles (UAV), by demonstrating the concepts of a curved sensor array for vision system (CSVS) capable of being integrated to small form factor applications in order to provide visualization capability to pilots and other war fighters. The technical challenges are how to design a curved substrate with radius of curvature of 1 in and FOV of 40 degrees suitable for sensor integration, how to pattern the TFT pixel readout circuit on such curved substrate, and how to integrate a photodetector array on the curved TFT backpanel plate. In Phase I, we will develop a top-sensing polymer photodetector with spectral response from 400 nm to 900+ nm capable of being integrated onto the curved substrate. We will design a curved substrate meeting the program"s specification. We will demonstrate the feasibility of making metal oxide TFTs and active matrix image pixels on the curved substrate. Continuing into Phase II, we will develop a photodetector covering wavelength from 300nm to beyond 1400nm, and we will design and develop a sensor array on the curved substrate. BENEFIT: We expect that the completion of the proposed work would have an immediate impact on military and commercial applications. By developing a VIS-NIR-SWIR sensor array on a curved substrate, the complex optics system to convert a curved field-of-view (FOV) into a flat focal plane array could be avoided. As a result, the volume, weight, and expense of the objective optics which used to make it extremely difficult for the installation of such sensor system into applications where weight and space are critical, are no longer the issue. Those benefits are not only beneficial to the military applications such as HM and small UVA, but also to the commercial applications such as cameras embedded in consumer electronics, homeland security, and automobile navigation.