ULTRA COMMUNICATIONS, INC. — Department of Defense SBIR Phase I: This program teams UltraComm with Endicott Interconnect (EI), the USA leader in polymer wa

Description

This program teams UltraComm with Endicott Interconnect (EI), the USA leader in polymer waveguide technology. EI has extensive experience delivering next generation waveguide/PCB systems to IBM for commercial supercomputer applications. These systems delivered multi-Tbps to the chip over MM waveguides. This effort will leverage Ultracomm"s experience developing military and space avionics transceivers and design of micro-optics and expanded beam optical connections with the world class PCB manufacturing available at EI to develop innovative methods of coupling light to SM waveguide structures within the PCB. This program will extend EI"s manufacturing capability to SM waveguide structures on PCB"s. Ultracomm"s experience designing and building modules with refractive and diffractive expanded beam interfaces will enable a system with alignment tolerances well within the capacity of PCB manufacturing providing the critical interface between the waveguide interconnect and the transceiver.