INTERLOG CORPORATION — Department of Defense SBIR Phase I: MDA17-011
INTERLOG CORPORATION — SBIR Phase I award from Department of Defense.
- Amount
- $100,000
- Agency
- Department of Defense · Missile Defense Agency
- Program / Phase
- SBIR · Phase I
- Topic
- MDA17-011
- Solicitation
- 2017.2
- NAICS
- —
- Place of performance
- CA
- Period
- 2017-11-06 → 2018-05-05
Description
The MDA is seeking a new additive manufacturing (AM) process compliant with MIL-PRF-38535 for a semiconductor die packaging to reduce potential risks and susceptibility of counterfeiting via on-site packaging and anti-counterfeit measures. Interlog Corporation proposes to develop a new Universal Additive Manufacturing Packaging (UAMP) process that provides ultrafine die-packaging, not only for old packaging (QFP/PGA/BGA) but also new packaging types (FCBGA/WLSCP, 3DIC, etc.), on a single AM platform using novel, combined layer deposition/bonding methods. The innovation of UAMP is a novel heterogeneous bonding method optimized for die-packaging for various packaging elements. In Phase I, Interlog Corporation will develop a TRL 4 prototype for a laboratory demonstration with key UAMP process design and performance requirements.Approved for Public Release | 17-MDA-9395(24 Oct 17)