Microwave Packaging Technology, Inc. — Department of Defense SBIR Phase II: A11-074

Description

The US Department of Defense (DoD) procures phased arrays and deploys them on multiple platforms. A key component in these systems is the digital receiver. They enable tracking of multiple simultaneous targets such as missile launch vehicles, payloads, and re-entry vehicles (to name a few). The cost of these components limits their wide spread deployment. More importantly, existing digital receivers use proprietary interfaces and packaging. Therefore, Microwave Packaging Technology, Inc. (MPT) is developing an affordable open architecture digital receiver. Specifically, we are following industry open standards and specifications for the digital interfaces and using the industry standard 3U ATR enclosure to ensure that the resulting product conforms to the open architecture. MPT has teamed with Xilinx, Inc. for field programmable gate arrays; and, with Analog Devices, Inc for analog to digital converters. MPT is closely aligned with Raytheon as the system integrator of the resulting product. Approved for Public Release | 16-MDA-8863 (22 September 16)