GLOBAL CIRCUIT INNOVATIONS INC — Department of Defense SBIR Phase II: DLA192-001

GLOBAL CIRCUIT INNOVATIONS INC — SBIR Phase II award from Department of Defense.

Amount
$994,121
Agency
Department of Defense · Defense Logistics Agency
Program / Phase
SBIR · Phase II
Topic
DLA192-001
Solicitation
19.2
NAICS
Place of performance
CO
Period
2020-07-07 → 2022-07-06

Description

Reverse Engineering of Circuit Card Assembly (CCA) – The Phase I SBIR effort determined that there was a need for Failure Analysis effort to address replacement for a Circuit Card Assembly (CCA). This CCA is not obsolete and there is DLA stock. However, the end user has indicated they have had high failure rates for the past 10 years and are seeking a new source of supply. GCI has implemented failure analysis on this part to determine the issue and therefore, will determine a path forward to reverse engineer this CCA to provide a form, fit and function CCA that will be reliable and meet all specification in the Phase II effort. It will also be tested and work successfully in the customer’s next higher assemblies: SRU and LRU. The corresponding NSN for this CCA is 5998-01-549-7929. The ESA (Engineering Support Authority) for this project is Mr. Scott Mahoney, Product Realization Engineer Supporting Lower Tier Project Office (PATRIOT) & CECOM ILSC Power & Environmental Directorate, C5ISR Center, Product Realization Systems Engineering & Quality Directorate (PRD) U. S. Army Combat Capabilities Development Command (CCDC). Obsolete Resistor Assembly – In the Phase I SBIR effort, it was determined that there was a need for a replacement for an obsolete Resistor Assembly used on the B-52 aircraft, NSN 5905-00642-1235. The Engineering Support Authority (ESA) for this project is Blaine Finley, AFLCMC/WWDEA, B-52 Avionics Engineer. GCI worked with Thom Farleigh of Bill McClung, Inc. to purchase a Technical Data Package and a sample resistor part. GCI has spent considerable time reviewing the final technical drawings and the Bill of Materials (BOM), testing requirements, and sources of supply for all components. In the Phase II program, GCI will continue the engineering approach inititiated in Phase I to test and qualify a form, fit and function drop-in replacement resistor assembly that meets all requirements and works successfully in the customer’s next higher assemblies: Shop Replaceable Unit (SRU) and Line Replaceable Unit (LRU). Obsolete Hermetically Packaged Microprocessor – The Phase I SBIR effort also determined that there was a need for a replacement for a microprocessor, commonly used throughout the DoD, NSN 5962-01-334-8159. The ESA for this project is Tuan M. Ha, 422 SCMS/GUEAB, Tinker AFB, OK. In the Phase II program, GCI will continue the engineering approach initiated in Phase I to test and qualify a form, fit and function drop-in replacement resistor assembly that meets all requirements and works successfully in the customer’s next higher assemblies: SRU and LRU.