GLOBAL CIRCUIT INNOVATIONS INC — Department of Defense SBIR Phase I: AF193-CSO1

Description

Global Circuit Innovations (GCI) has developed innovative proprietary technologies available to the USAF that can provide solutions to military electronic obsolescence. GCI will utilize these commercially successful reverse engineering technologies that currently benefit the oil & gas industry to provide electrical microcircuits and a fully functional Multi-Chip Module (MCM) with proven durability in harsh environmental conditions to the USAF. GCI is not designing new components, but will acquire Original Device Manufactured (ODM) microcircuits to reverse engineer components to provide form, fit, and function drop-in replacements. For this effort, GCI plans to address an obsolete 512Kx32 SRAM, brought to our attention by Michael Spencer, F-22 Program Technical Lead at BAE Electronic Systems. This 512Kx32 SRAM is used in a module within the RF unit in the Electronic Warfare (EW) system of a F-22 which is supported at the Ogden Air Logistics Complex (OO-ALC) at Hill AFB, UT. GCI will identify the requirements of this 512Kx32 SRAM to generate a form, fit and function drop-in replacement MCM. In a Phase II Program, GCI will complete the customer validation process and deliver a fully functional production MCM. This will include procurement of necessary die and passive components; fabrication of any required internal cavity