CRYSTAL SONIC, INC. — National Aeronautics and Space Administration SBIR Phase II: 4-Photo

Description

High substrate costs limit the proliferation of many next-generation semiconductor device applications, such as high-efficiency GaAs-based photovoltaics for space applications, often consuming 50% of the cell manufacturing cost. We propose a novel substrate re-use technology, known as Sonic Lift-off (SLO), to drive down the costs of space photovoltaic manufacturing. SLO utilizes sound to separate thin devices from their host substrate, leaving the remaining substrate available for multiple reuses. A key milestone in the march towards commercialization is the ability to demonstrate the technology at industrially relevant wafer diameters and on real-world functioning devices. In this proposal we plan to build upon our successes to date in Phase I, moving from 4" wafer SLO feasibilityto functioning 4" device feasibility and optimization. For this effort, a new SLO alpha tool ('Gen2') will be built and operated in order to demonstrate overall performance.