NIELSON SCIENTIFIC LLC — Department of Defense SBIR Phase I: A19-049

Description

We propose developing a small pitch probe card with a pitch down to 5 µm that will have minimal thermally induced deformations over an operational temperature range of 77 to 300 Kelvin. The probe card design will contain eight probe points initially, but the number of points can be increased or decreased as needed by the customer. The pitch can also be specified anywhere from 5 µm and up. The probe card will be a MEMS based structure built with silicon carbide. By using silicon carbide, the alignment between the probe points and the test chip pixels will be easier because silicon carbide is transparent at visible wavelengths. The high elastic modulus and strength of silicon carbide will enable the probe to be robust at cryogenic temperature and minimize thermally induced deformations. MEMS fabrication of silicon carbide will make the probe tip array flexible relative to support frame to avoid any damage to the FPA.