WINCHESTER TECHNOLOGIES LLC — Department of Defense STTR Phase II: A16-020
WINCHESTER TECHNOLOGIES LLC — STTR Phase II award from Department of Defense.
Phase II STTR prototype / development signal
- Phase II is where Department of Defense funds deeper R&D after feasibility. Incumbents with Phase II history are serious competitors on adjacent topics.
- Use this award as past-performance context and to map customer organizations for STRATFI/TACFI-style transition planning.
- Obligated amount $500,000 is consistent with substantial Phase II-scale effort; compare to related awards from the same agency.
- Topic code A16-020 links this award to a solicitation family — search the same topic stem for incumbents and recompete timing.
- Amount
- $500,000
- Agency
- Department of Defense · Army
- Program / Phase
- STTR · Phase II
- Topic
- A16-020
- Solicitation
- 16.1
- NAICS
- —
- Place of performance
- MA
- Period
- 2018-09-28 → 2019-09-28
Description
Integration of RF ferrites on printed circuit boards (PCBs) is highly desired for realizing compact, lightweight and low-cost systems with different RF ferrite components, including inductors, antennas and antenna arrays, etc. However, it has been challenging to integrate ferrites on PCBs. Spin spray deposition can produce fully dense, high crystalline quality, and low-loss RF ferrites at a low temperature at a low cost. However, spin spray technique and facilities are not commercially available. Two major challenges severely limit ferrite integration on PCBs by spin spray deposition: (1) limited ferrite film thickness of <5~10 µm; and (2) limited area of deposition on PCBs. Based on their extensive experience on spin spray deposition facilities, processes, ferrite materials, and RF ferrite devices, the PIs have developed new low-temperature spin spray and linear spray deposition technologies and processes for low-loss, high quality ferrite films and ferrite/insulator multilayers with large thickness >5~10 µm, low loss tangent <5% at >1GHz on PCBs, thus enabling low-temperature ferrite deposition large scale (36”×48”) PCB panels. At the same time, new compact integrated RF ferrite devices, including antennas and inductors have been demonstrated on ferrite coated PCBs. The project team is well positioned for the Phase II efforts.