Chip Design Systems Inc. — Department of Defense SBIR Phase II: MDA13-017
Chip Design Systems Inc. — SBIR Phase II award from Department of Defense.
- Amount
- $1,000,000
- Agency
- Department of Defense · Missile Defense Agency
- Program / Phase
- SBIR · Phase II
- Topic
- MDA13-017
- Solicitation
- 2013.2
- NAICS
- —
- Place of performance
- DE
- Period
- 2015-05-13 → 2017-05-12
Description
We propose to monolithically integrate an infrared light emitting diode (IRLED) array on the backside of a GaAs substrate whose frontside contains an array of driver circuits. We will develop smaller GaAs substrate via technology to enable smaller pixel pitch and realize a large-scale GaAs-SLEDS read-in integrated circuit (RIIC). Our team consists of experts in IRLED fabrication, RIIC design, GaAs IC fabrication, system design, and thermal modeling. Approved for Public Release 15-MDA-8169 (20 March 15)