Chip Design Systems Inc. — Department of Defense SBIR Phase II: MDA13-017
Chip Design Systems Inc. — SBIR Phase II award from Department of Defense.
Phase II SBIR prototype / development signal
- Phase II is where Department of Defense funds deeper R&D after feasibility. Incumbents with Phase II history are serious competitors on adjacent topics.
- Use this award as past-performance context and to map customer organizations for STRATFI/TACFI-style transition planning.
- Obligated amount $1,000,000 is consistent with substantial Phase II-scale effort; compare to related awards from the same agency.
- Topic code MDA13-017 links this award to a solicitation family — search the same topic stem for incumbents and recompete timing.
- Amount
- $1,000,000
- Agency
- Department of Defense · Missile Defense Agency
- Program / Phase
- SBIR · Phase II
- Topic
- MDA13-017
- Solicitation
- 2013.2
- NAICS
- —
- Place of performance
- DE
- Period
- 2015-05-13 → 2017-05-12
Description
We propose to monolithically integrate an infrared light emitting diode (IRLED) array on the backside of a GaAs substrate whose frontside contains an array of driver circuits. We will develop smaller GaAs substrate via technology to enable smaller pixel pitch and realize a large-scale GaAs-SLEDS read-in integrated circuit (RIIC). Our team consists of experts in IRLED fabrication, RIIC design, GaAs IC fabrication, system design, and thermal modeling. Approved for Public Release 15-MDA-8169 (20 March 15)