COOLCAD ELECTRONICS, INC. — Department of Defense SBIR Phase I: MDA22-008
COOLCAD ELECTRONICS, INC. — SBIR Phase I award from Department of Defense.
Phase I SBIR feasibility signal
- Phase I awards fund proof-of-concept work. For capture teams, they mark early interest from Department of Defense in a technical approach.
- Watch for Phase II follow-ons from the same firm/topic family — that conversion path is where budgets and transition pressure rise.
- Obligated amount $149,999. Cross-check similar awards in the same agency and technology tags for going-rate context.
- Topic code MDA22-008 links this award to a solicitation family — search the same topic stem for incumbents and recompete timing.
- Amount
- $149,999
- Agency
- Department of Defense · Missile Defense Agency
- Program / Phase
- SBIR · Phase I
- Topic
- MDA22-008
- Solicitation
- 22.1
- NAICS
- —
- Place of performance
- MD
- Period
- 2022-07-25 → 2023-01-24
Description
Temperature hardened electronics are being developed for harsh airborne applications. To complement these efforts, high temperature packaging studies need to follow suit. To address this problem, the proposed work covers an initial feasibility analysis of high temperature compatible materials and substrates for long term use as circuit boards, interconnects and attach material. Additionally, the proposed work covers an exploratory set of small-scale experiments and a proof-of-concept demonstration. More specifically, the work is divided into four tasks that focus on a) high temperature compatible material selection and physics simulations, b) investigation of our existing silicon carbide devices for ultra-high temperature applications, c) building a small-scale proof-of-concept prototype, and d) plans for the follow-up Phase II. In summation, the project is built on a well-rounded approach of “design for manufacturing” and ‘design for reliability” for the development of high temperature packaging and associated electronics. Approved for Public Release | 22-MDA-11215 (27 Jul 22)